Fuzhou X-Meritan Technology Co., Ltd. is a China-based manufacturer specializing in semiconductor thermoelectric cooling. With a proven track record in thermal management engineering, we provide an end-to-end service chain — from thermoelectric material development and core component customization to heat dissipation solution design and full-process selection support. Our engineering team works closely with customers to translate their thermal targets into reliable, production-ready TEC solutions.
Our capabilities span five major sectors: fiber-optic communications, industrial and medical equipment, smart automotive electronics, consumer electronics, and research institutions. We work with leading technology companies and research organizations, supporting applications that demand precise temperature control — including optical transceivers, 5G base station lasers, LiDAR sensors, PCR instruments, and medical laser systems.
Our production facility is equipped with a comprehensive range of manufacturing and assembly equipment, including tin dipping furnaces, vibration swing mold machines, automatic sealing machines, reflow soldering systems, fully automatic printing machines, dispensing machines, cutting machines, and solidification equipment. This vertically integrated production setup allows us to control quality at every stage — from material preparation and TEC module assembly to final testing and packaging. We support both standard product orders and custom manufacturing based on customer drawings or performance specifications.
We operate under an internationally recognized quality management system and comply with RoHS and REACH environmental standards. Every thermoelectric cooler undergoes performance testing before shipment, including cooling capacity verification, ΔTmax measurement, AC resistance testing, and visual inspection. Reliability testing follows industry-standard protocols for thermal cycling, mechanical shock, and vibration. Test reports and compliance declarations are available upon request.
Adhering to the principle of “quality as a foundation, service as an enabler,” X-meritan combines material R&D, device manufacturing, thermal design, and full-lifecycle support in one vertical ecosystem. Our proprietary semiconductor thermal management technology matrix and our continuous monitoring of cutting-edge industry trends allow us to help clients shorten R&D cycles and optimize product performance. From material selection to final assembly, we provide full lifecycle technical support to global partners in 5G communications, LiDAR, biomedicine, and other advanced thermal management fields.
Our vertically integrated manufacturing facility is equipped with a complete range of production and assembly equipment:
Tin dipping furnaces — for uniform solder application on TEC module terminals
Vibration swing mold machines — for precise pellet placement during module assembly
Reflow soldering systems — for high-consistency solder joints in TEC and assembly production
Fully automatic printing machines — for ceramic substrate metallization and patterning
Automatic sealing machines — for hermetic sealing of micro TEC packages
Dispensing machines — for thermal interface material application
Cutting machines and solidification equipment — for material preparation and final shaping
Welding machines, ovens, inkjet printers, and soldering irons — for assembly, marking, and finishing operations
This equipment base supports both high-volume standard production and flexible custom manufacturing, enabling us to control quality at every stage from material preparation to finished TEC assembly.
