X-meritan is a China manufacturer and supplier specializing in thermoelectric cooling solutions. We offer a range of Temperature Controllers for Micro TE Coolers designed for Micro-TEC modules compact thermoelectric coolers used in applications requiring precise temperature regulation. Our controllers manage current to enable both cooling and heating, holding target objects at stable setpoint temperatures. These products serve optical communications, biological and medical equipment, consumer electronics, and automotive/aerospace sectors. All controllers are designed and manufactured under our in-house quality system, with customization options available for electrical parameters, physical dimensions, communication protocols, and environmental adaptability.
Temperature Controllers for Micro TE Coolers regulates the current flowing through the thermoelectric cooler in order to stabilize the temperature at the desired value. It continuously monitors the temperature of the target object and adjusts the output current based on the temperature difference and reverse the direction to switch between heating and cooling modes, and changing the magnitude to control the intensity.
Current polarity can be reversed, enabling the TEC to switch between cooling and heating modes. For applications such as PCR that require alternating thermal cycles.
An internal feedback loop continuously reads the actual temperature of the target object, compares it against the setpoint, and automatically adjusts the output until the temperature stabilises. No manual intervention is required.
Output current and voltage can be configured according to the specifications of the TEC being driven, covering a power range from milliwatts to hundreds of watts.
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Customization Options |
Core Content |
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Electrical Parameters |
Input voltage and output current/voltage matching |
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Physical Dimensions and Interfaces |
PCB form factor, connector location and type |
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Temperature Control Performance |
Control accuracy and operating temperature range |
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Communication and Control Protocols |
Communication interface and command set customization |
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Sensor Compatibility |
Support for different temperature sensor types |
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Environmental Adaptability |
Ruggedization for specific operating environments |
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Product Form Factor |
Single-chip solution vs. modular product form customization |
Stabilises laser (such as DFB laser) wavelength. Temperature changes affect laser wavelength, preventing signal crosstalk caused by temperature drift.
Used in PCR instruments and similar devices. PCR reactions require specific temperature conditions, making precise thermal cycling essential.
Provides localised precision cooling for high-performance chips (such as GPU). Prevents chips from overheating under heavy load, which would otherwise trigger throttling and compromise user experience.
Stabilises the performance of precision sensors such as LiDAR. Prevents sensor reading drift caused by ambient temperature changes, keeping measurements consistently accurate.
Yes, as long as the controller's output current and voltage ratings exceed the TEC's Imax and Vmax. Selecting a controller with sufficient headroom allows the same controller to drive multiple TEC models across different product lines.
Stability depends on the control algorithm and sensor resolution. With a properly tuned PID loop and a high-resolution ADC, ±0.01°C or better is achievable for many optical and laboratory applications.
Analog voltage control, PWM input, I²C, SPI, UART, and USB are available depending on the model. Specify your host system integration requirements and we can recommend the appropriate interface.
Yes. We support OEM customization of control parameters, output ranges, interface selection, and form factor. We follow a samplebased development process: preliminary discussion → sample production → customer validation → mass production.
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Equipment |
Description |
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Tin dipping furnaces |
Pre-tinning of component leads to improve solderability and prevent oxidation |
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Vibration swing molding machines |
Air bubble elimination and uniform distribution of encapsulating materials during potting or molding |
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Welding machines |
Spot or ultrasonic welding for internal leads, thermocouple wires, and module terminals |
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Ovens |
Drying, preheating, and curing of adhesives and coatings |
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Inkjet printers |
Printing of identification marks, model numbers, and batch codes for traceability |
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Dispensing machines |
Precision application of thermal interface materials, adhesives, or encapsulants |
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Automatic sealing machines |
Hermetic sealing of modules or packages to prevent moisture and contaminant ingress |
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Cutting machines |
Dimensional cutting of ceramic substrates, PCBs, or lead frames |
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Solidification machines |
Accelerated curing or hardening of resins and potting compounds |
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Reflow soldering systems |
SMT soldering of surface mount components under controlled temperature profiles |
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Fully automatic printing machines |
High precision printing of solder paste or conductive adhesives prior to component placement |
