X-Meritan manufactures precision Assemblies with Micro Thermoelectric Coolers to eliminate the thermal bottlenecks, outgassing risks, and assembly complexities associated with mounting discrete cooling components. By integrating micro-Peltier elements, custom header bases (Kovar, CuW, HTCC/LTCC), and feedback thermistors under cleanroom conditions, this solution forms an turn-key sub-assembly ready for die-attach. Active spot cooling directly beneath the optical chip minimizes dark noise in sensor arrays and locks in emission wavelengths for high-power laser diodes.
Utilized widely across telecom transceivers, VCSELs, and miniature spectroscopic sensors. Header bases feature nickel/gold-plated Kovar or steel with custom pin geometry (cylindrical, flattened ends, or nail-head) to streamline internal wire bonding.
|
Package Style |
Base Material |
Pin Options |
Primary Application |
TEC Staging |
|
TO-8 |
Kovar / Gold-plated Steel |
6, 12, 16 pins |
IR, XRF, & Gas Detectors |
Single to 4-stage |
|
TO-39 |
Kovar |
6, 8+ pins |
Analytical Sensor Arrays |
Single to 2-stage |
|
TO-46 |
Kovar |
5, 6 pins |
VCSELs & Micro-Sensors |
Single-stage |
|
TO-66 |
Kovar |
6, 9 pins |
High-Density Detector Units |
Single to 4-stage |
|
TO-37 / TO-13 |
Kovar / Steel |
6 to 16 pins |
Multi-channel IR Arrays |
Single to 2-stage |
Engineered for multi-watt thermal loads and dense photodetector arrays where structural rigidity and precise co-planarity are paramount.
|
Enclosure Type |
Construction Materials |
Pin Count |
Typical Target Device |
|
BTF (Butterfly) |
Kovar with Copper-Tungsten (CuW) Base |
14 pins |
Pump Lasers & Telecom Transmitters |
|
HHL (High Heat Load) |
Kovar, Steel, or Copper-Moly (CuMo) |
9 pins |
High-Power Industrial Lasers |
|
PS-28 / BOX |
Ni/Au-Plated Kovar Enclosures |
28 pins |
Multi-element Optical Detectors |
|
TOSA / ROSA |
Kovar with CuW Heat Spreaders |
Custom |
Sub-miniature Transceiver Assemblies |
|
HTCC / LTCC |
High/Low-Temp Co-fired Ceramics |
Array Pins |
Low-Noise Photodetector Arrays |
Eutectic Micro-Bonding: Sub-modules are soldered using AuSn eutectic preforms directly to package headers, eliminating conductive epoxies and avoiding organic outgassing in hermetic seals.
Dark Noise Suppression: Active spot cooling lowers photodetector array junction temperatures, reducing thermal dark current and improving overall signal-to-noise ratios (S/N).
Flexible Lead Frame Configurations: Header pins can be modified with flattened surfaces or spiked tips to lower loop inductance and simplify automated wire-bonding processes.
Multi-Stage Staging Capabilities: Accommodates single-stage to 4-stage micro-TEC configurations for applications requiring deep cooling differentials (ΔT>70∘C).
Co-Developed Packaging (JDP): Full application engineering support from thermal CAD modeling and material selection to rapid sample prototyping and mass volume manufacturing.
Provides wavelength stabilization for TOSA/ROSA transceivers, EML lasers, and DWDM networks by locking the laser junction temperature under variable case temperatures.
Assemblies with Micro Thermoelectric Coolers supplies cold-substrate platforms for X-ray fluorescence (XRF) and non-dispersive infrared (NDIR) sensors, preventing signal drift during environmental analysis.
Manages heat flux inside Butterfly (BTF) and High Heat Load (HHL) packages, maintaining beam quality and extending diode life.
Cooling for focal plane arrays (FPA), night-vision detectors, and optical guidance sensors subjected to harsh mechanical vibration and thermal shock.
In-House Cleanroom Packaging: All micro-TEC placements, wire bonding, and sealing operations take place in controlled environments to prevent oxidation and moisture trapping.
100% Parameter Screening: Every Assemblies with Micro Thermoelectric Coolers undergoes testing for AC resistance (Rac), insulation resistance, thermal response, and dimensional tolerances before shipment.
Traceable Supply Chain Integrity: Direct partnership with validated header manufacturers ensures gold-plating adhesion, vacuum tightness, and strict compliance with ISO9001 standards.
Pre-integrated assemblies eliminate complex manual micro-soldering, guarantee factory-verified eutectic bond integrity (Rth minimization), and prevent outgassing contamination inside sealed packages.
Yes. Through our Joint Development Packaging (JDP) program, customers can either select from our standard Kovar/CuW headers or ship proprietary housings for factory TEC integration and wire-bonding.
Unlike organic adhesives or standard soft solders, AuSn eutectic bonding provides higher thermal conductivity, zero organic outgassing, and strong joint strength that withstands high-temperature die-attach operations downstream.
Please provide target package style (e.g., TO-8, BTF), heat load (Qc), target temperature difference (ΔT), pin configuration requirements, and preferred driving voltage/current limits.
Address
Building C2, R&F Center, Shangpu Road, Taijiang District, Fuzhou City, Fujian Province, China
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Ready to start your next thermal management project or request a competitive price quote? The X-meritan engineering and sales team is standing by to analyze your project requirements, recommend suitable standard TEC models, or discuss fully custom thermoelectric cooler manufacturing options.
Simply fill out the inquiry form with your operating parameters—such as heat load, ambient temperature, target cold-side temperature, dimensions, and estimated annual volume. Our technical sales engineers will review your thermal constraints and respond with a detailed quotation and engineering assessment within 24 business hours.
