X-meritan manufactures Extruded Thermoelectric Materials based on Bi2Te3-Sb2Te3 solid solution materials for thermoelectric cooling elements, Peltier modules, and temperature control components.
They are Bi2Te3-based semiconductor materials processed through extrusion technology to obtain dense, fine-grained, and textured structures.
Compared with traditional melting-based preparation methods, extrusion processing improves grain bonding through plastic deformation, enhancing mechanical processing performance while maintaining thermoelectric properties.
Main material systems include:
● Bi2Te3-Sb2Te3 Thermoelectric Alloys: Used for thermoelectric cooling applications near room temperature.
● N-Type Thermoelectric Materials: Combined with P-type materials to form thermoelectric couples.
● P-Type Thermoelectric Materials: Provide complementary electrical characteristics in TEC structures.
Applications include:
● Thermoelectric Cooling Elements: Semiconductor components for Peltier cooling systems.
● Peltier Modules: Cooling devices based on thermoelectric elements.
● Micro TEC Components: Thin thermoelectric structures for compact equipment.
● Multi-Stage TEC Structures: Layered cooling structures requiring consistent element performance.
● Temperature Control Devices: Components for thermal regulation systems.
|
Parameter |
Specification |
|
Material System |
Bi2Te3-Sb2Te3 |
|
Material Type |
N-Type / P-Type Thermoelectric Materials |
|
Extruded Ingot Length |
120 mm / 240 mm |
|
Extruded Ingot Diameter |
25 mm / 30 mm / 35 mm |
|
Electrical Conductivity |
870–1430 Ohm⁻¹cm⁻¹ |
|
Material Structure |
Dense textured structure |
|
Thin Chip Processing Capability |
Down to 0.2 mm |
Mechanical properties affect cutting, slicing, thinning, and assembly processes during TEC manufacturing. Extrusion processing improves intergranular bonding through plastic deformation and reduces structural defects during machining.
|
Mechanical Property |
N-Type Material |
P-Type Material |
|
Compressive Strength (MPa) |
54.0 |
66.0 |
|
Shear Strength (MPa) |
16.0 |
21.0 |
|
Young's Modulus (GPa) |
47.0 |
42.0 |
|
Poisson's Ratio |
0.30 |
0.30 |
The material strength allows thermoelectric chips to be processed to thicknesses down to 0.2 mm.
Key characteristics:
● Electrical Conductivity: 870–1430 Ohm⁻¹cm⁻¹.
● Material Structure: Dense and uniform internal structure.
● Texture Orientation: Controlled grain orientation for element consistency.
● Thermoelectric Performance Parameter: Reaches 2.9 × 10⁻³ under 25°C vacuum conditions.
Traditional zone melting materials can achieve thermoelectric performance but may have limitations during cutting and thinning because of cleavage characteristics.
|
Comparison Item |
Extruded Bi2Te3-Sb2Te3 Materials |
Traditional Zone Melting Materials |
|
Internal Structure |
Dense textured structure |
Directional crystal structure |
|
Mechanical Processing |
Higher resistance during cutting and thinning |
More sensitive to cleavage-related defects |
|
Thin Chip Fabrication |
Supports 0.2 mm thin TEC components |
More difficult for ultra-thin processing |
|
Material Consistency |
Controlled texture uniformity |
Dependent on crystal growth conditions |
|
Applications |
Micro TEC, multi-stage TEC, precision cooling |
Conventional TEC applications |
Thermoelectric cooling devices require balanced electrical, thermal, and mechanical properties.
Key advantages:
Thin Chip Capability: Mechanical strength supports slicing and thinning processes for thermoelectric chips down to 0.2 mm.
Structural Uniformity: Textured structures improve consistency between thermoelectric elements used in multi-element and multi-stage TEC configurations.
Material Structure: Improved grain bonding helps maintain material integrity during repeated heating and cooling cycles.
Dense Structure: High-density material structures are suitable for compact thermoelectric components.
Optical Communication Cooling: Used for thin thermoelectric elements in optical transceiver and laser temperature control systems.
Applications:
● Optical Transceiver Cooling: Temperature control of optical components.
● Laser Diode Temperature Control: Thermal regulation for laser devices.
● Fiber Communication Modules: Compact cooling structures.
Multi-Layer Cooling Structures: Used where multiple thermoelectric layers require consistent performance.
Applications:
● Stacked Thermoelectric Structures: Multi-layer TEC configurations.
● High-Precision Temperature Control: Thermal regulation systems.
● Compact Cooling Systems: Limited-space cooling applications.
Large-Diameter Extruded Ingots: Used for larger thermoelectric cooling components.
Applications:
● Industrial Temperature Control Equipment: Localized thermal management.
● Electronic Cooling Systems: Semiconductor thermal control.
● Semiconductor Equipment: Precision electronic cooling.
Precision Cooling Components: Used in medical refrigeration and laboratory temperature control equipment.
Applications:
● Medical Refrigeration Systems
● Laboratory Temperature Control Equipment
● Research Instruments
|
Material Type |
Main Characteristics |
Applications |
|
Bi2Te3-Sb2Te3 |
Thermoelectric performance near room temperature |
TEC modules, Peltier cooling components |
|
N-Type Bi2Te3 |
Electrical conductivity and mechanical strength |
Thermoelectric element pairs |
|
P-Type Bi2Te3-Sb2Te3 |
Mechanical strength and thermoelectric characteristics |
TEC cooling structures |
X-meritan integrates thermoelectric material preparation, extrusion processing, element processing, and assembly integration.
Manufacturing processes:
● Material Preparation: Preparation of thermoelectric material compositions.
● Extrusion Processing: Formation of dense textured structures.
● Element Processing: Cutting and shaping thermoelectric components.
● Electrical Connection: Welding and connection processing.
● Assembly Integration: Integration of thermoelectric structures.
● Performance Verification: Inspection of processed components.
Production equipment:
● Tin dipping furnace
● Vibration swing mold machine
● Welding machine
● Oven
● Dispensing machine
● Automatic sealing machine
● Cutting machine
● Solidification machine
● Reflow soldering equipment
● Fully automatic printing machine
X-meritan Extruded Thermoelectric Materials are based on Bi2Te3-Sb2Te3 materials with controlled electrical properties, dense textured structures, and mechanical characteristics for TEC manufacturing.
Specifications include electrical conductivity of 870–1430 Ohm⁻¹cm⁻¹, compressive strength up to 66 MPa, extruded ingot dimensions of 120 mm / 240 mm length and 25 mm / 30 mm / 35 mm diameter, and thin-chip processing capability down to 0.2 mm.
The materials are used for TEC manufacturing, Peltier modules, optical communication cooling, medical temperature control, and semiconductor thermal management applications.
Address
Building C2, R&F Center, Shangpu Road, Taijiang District, Fuzhou City, Fujian Province, China
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