NTC thermistors use a negative temperature coefficient characteristic, meaning their resistance changes as temperature changes. In a sensing circuit, the resistance variation can be converted into temperature information for monitoring and control.
For chip applications, the selection of R25, B value, resistance tolerance, chip dimensions, and electrode structure directly affects circuit matching and assembly. R25 refers to the nominal resistance at 25°C, while the B value describes the resistance-temperature characteristic of the thermistor.
The High-Precision NTC Thermistor Chip is intended for applications where the sensing element needs to be placed close to a temperature-sensitive component while keeping the occupied space small.
The following models represent available product specifications. Electrical values and dimensions should be selected according to the required circuit characteristics and assembly method.
|
Model |
R25 (kΩ) |
B Value (K) |
Dimensions L×W×T (mm) |
Rated Power at 25°C (mW) |
Dissipation Coefficient (mW/°C) |
Thermal Time Constant (s) |
|
DT502-3950A |
5.0 |
3950 |
1.0×1.0×0.5 |
<60 |
~1.2 |
≤3 |
|
DT103-3435B |
10.0 |
3435 |
0.95×0.95×0.6 |
<60 |
~1.2 |
≤3 |
|
DT103-3470A |
10.0 |
3470 |
1.0×1.0×0.5 |
<60 |
~1.2 |
≤3 |
|
DT103-3950A |
10.0 |
3950 |
1.1×1.1×0.46 |
<60 |
~1.2 |
≤3 |
|
DT203-3743A |
20.0 |
3743 |
1.1×1.1×0.6 |
<60 |
~1.2 |
≤3 |
|
DT303-3950A |
30.0 |
3950 |
1.0×1.0×0.55 |
<60 |
~1.2 |
≤3 |
|
DT473-4050A |
47.0 |
4050 |
0.45×0.45×0.25 |
<10 |
~0.2 |
≤2 |
|
DT503-3950A |
50.0 |
3950 |
1.0×1.0×0.55 |
<60 |
~1.2 |
≤3 |
|
DT104-3950A |
100.0 |
3950 |
0.95×0.95×0.6 |
<60 |
~1.2 |
≤3 |
|
DT104-3964F |
100.0 |
3964 |
0.45×0.45×0.2 |
<10 |
~0.2 |
≤2 |
|
DT104-4100A |
100.0 |
4100 |
0.95×0.95×0.6 |
<60 |
~1.2 |
≤3 |
|
Parameter |
Available Range |
|
Resistance |
1kΩ–1000kΩ |
|
B Value |
3200K–4500K |
|
Chip Size |
From 0.3 mm, depending on structure |
|
Resistance Tolerance |
±0.5%, ±1% |
The High-Precision NTC Thermistor Chip is available in compact structures for applications where a conventional packaged temperature sensor would occupy too much space. Selected models in the current range are as small as 0.45 × 0.45 mm, while customized chip dimensions can be evaluated from customer drawings or samples.
The small chip structure is suitable for placing the sensing element close to optical, electronic, or other temperature-sensitive components. Final dimensions should be confirmed according to the required electrical characteristics and assembly process.
The chip can be supplied with gold or silver plated electrodes for wire bonding. Gold, aluminum, and silver wire bonding can be supported depending on the electrode configuration and assembly process.
This structure is suitable for compact hybrid modules and other assemblies where the thermistor needs to be integrated directly into the sensing area. Electrode material and bonding requirements can be confirmed during sample evaluation.
Wire-bondable NTC thermistors are also used in compact optical transceiver applications, where the sensing element is positioned close to the temperature-sensitive optical components.
Resistance and B value should be selected as a matched combination rather than treated as completely independent parameters. The available resistance range is 1kΩ to 1000kΩ, while the B value range is 3200K to 4500K.
For circuit design, the nominal resistance at 25°C, B value, tolerance, and required sensing range should be considered together. Standard combinations are available, and non-standard requirements can be evaluated based on the application.
The B value is normally specified together with its reference temperature range, such as B25/50 or B25/85, so the exact definition should be confirmed on the applicable product specification before circuit calibration. Commercial chip NTC product data from major manufacturers similarly specifies R25 and B values with defined reference temperatures.
Selected models can be supplied with resistance tolerance options of ±0.5% and ±1%. This specification describes the allowable deviation of the nominal resistance value and should not be presented as the overall temperature measurement accuracy.
For temperature-sensitive circuits, resistance tolerance, B-value tolerance, circuit design, calibration method, and operating conditions can all affect the final temperature measurement result. The required tolerance should therefore be selected according to the complete sensing system.
The thermal time constant of the listed models is ≤2 s or ≤3 s, depending on the chip structure and model. A smaller thermal time constant generally indicates that the thermistor reaches thermal equilibrium with its surrounding conditions more quickly.
The actual response in an assembled module also depends on mounting method, thermal coupling, surrounding materials, and airflow. For this reason, the chip specification should be evaluated together with the actual installation structure.
The High-Precision NTC Thermistor Chip can be integrated into optical communication modules and optical transceivers for temperature monitoring. Its compact structure allows the sensing element to be positioned close to temperature-sensitive optical components without adding a conventional external sensor package.
This is particularly relevant in optical assemblies where available installation space is limited and temperature changes need to be monitored close to the component being controlled. Wire-bondable NTC thermistors are specifically used for temperature sensing in optical transceiver designs.
Compact NTC chips can be integrated into medical instruments and laboratory equipment where the temperature sensing element needs to fit into a restricted installation area. Different resistance values, B values, and tolerance options allow the component to be matched with different sensing circuits.
The final specification should be selected according to the required temperature range, circuit characteristics, installation method, and applicable equipment requirements.
Automotive radar modules contain compact electronic components that may require temperature monitoring during operation. The small form factor of the NTC chip allows temperature sensing to be integrated into high-density electronic assemblies.
For automotive applications, the required operating temperature, resistance characteristics, tolerance, mechanical structure, and reliability requirements should be confirmed before selecting the final model.
The chip can also be used in laboratory and testing equipment where a compact temperature sensing element is required. Resistance and B value can be selected according to the sensing circuit, while chip dimensions can be considered together with the available installation space.
For prototype or customized equipment, X-Meritan can evaluate requirements based on customer drawings or samples before production.
The High-Precision NTC Thermistor Chip can be evaluated for customized electrical requirements. Available resistance values cover 1kΩ to 1000kΩ, with B values from 3200K to 4500K. Resistance tolerance options of ±0.5% and ±1% are available for selected specifications.
When requesting a customized model, customers can provide the required R25, B value, tolerance, operating conditions, and target application. These parameters help determine whether an existing model can be used or a new specification should be evaluated.
Chip dimensions can be evaluated according to the available installation space and assembly process. Existing models include compact structures such as 0.45 × 0.45 × 0.20 mm and 0.45 × 0.45 × 0.25 mm.
For non-standard dimensions, X-Meritan can review customer drawings or samples and confirm the achievable structure together with the required electrical parameters.
Gold or silver plated electrode options are available for different bonding requirements. The electrode material should be selected together with the intended wire material and bonding process.
During sample development, the electrode structure, bonding method, chip dimensions, and electrical characteristics can be checked before mass production.
X-Meritan manufactures semiconductor-related materials and components and provides production support for customized electronic components. The available production equipment includes vibration jig machines, welding machines, automatic packaging machines, and precision cutting equipment.
For customized NTC thermistor chips, production can be evaluated from customer samples or drawings. Before mass production, a sample confirmation stage can be used to verify dimensions, electrical parameters, electrode requirements, and assembly compatibility.
This process gives customers a defined point to check the product against their application requirements before releasing a larger production order.
The available resistance range is 1kΩ to 1000kΩ, with B values from 3200K to 4500K. Standard models include 5kΩ, 10kΩ, 20kΩ, 30kΩ, 47kΩ, 50kΩ, and 100kΩ resistance values.
Selected specifications are available with ±0.5% and ±1% resistance tolerance. The required tolerance should be selected according to the circuit and temperature sensing requirements.
Yes. Gold or silver plated electrode options are available. Gold, aluminum, and silver wire bonding can be evaluated according to the electrode configuration and assembly process.
The product range includes compact models such as 0.45 × 0.45 × 0.20 mm and 0.45 × 0.45 × 0.25 mm. Customized dimensions can be evaluated from customer drawings or samples, with the final size depending on the required electrical and structural specifications.
Yes. X-Meritan can evaluate customized resistance, B value, dimensions, tolerance, and electrode requirements. Customer drawings or samples can be used as the basis for product evaluation and sample confirmation.
Start with the required resistance at 25°C, B value, temperature sensing range, resistance tolerance, available installation space, and bonding method. For customized applications, providing the circuit requirements, installation drawing, or existing sample can help determine a suitable specification.
X-Meritan is a China-based manufacturer specializing in semiconductor-related materials, components, and thermal management products. Its capabilities cover material development, component manufacturing, customized production, and application support.
The company serves applications including optical communication, sensing, medical equipment, automotive electronics, and consumer electronics. Products are supplied to Europe, North America, South America, Southeast Asia, and other international markets.
For the High-Precision NTC Thermistor Chip, X-Meritan provides support from specification selection and sample evaluation to customized production. Customers can provide drawings, samples, or electrical requirements for technical evaluation before production
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