X-Meritan develops and manufactures thermoelectric cooling components. These components can be configured based on liquid flow rate, heat load, target temperature, available installation space, and air-side heat dissipation requirements. We produce Liquid-to-Air Thermoelectric Cooler Assemblies, an integrated thermal management solution that uses thermoelectric modules to transfer heat from the liquid circuit to the surrounding air. This system integrates a liquid cold plate, thermoelectric cooler, radiator, and fan into a single component, providing active temperature control for liquid-cooled equipment without the need for a compressor or refrigerant.
●iquid-to-Air Heat Transfer: Transfers heat from the liquid circuit to ambient air through a thermoelectric cooling module and air-cooled heat sink.
Active Temperature Control: Provides active cooling and heating for applications requiring controlled liquid temperatures.
Integrated Design: Combines the TEC module, liquid cold plate, heat sink, fan, and related components into a compact thermal assembly.
No Refrigerant: Uses solid-state thermoelectric cooling without a compressor or refrigerant circuit.
Compact & Low Vibration: No mechanical compressor within the TEC, making the assembly suitable for sensitive equipment and space-constrained systems.
Customizable Configuration: Cooling capacity, dimensions, liquid interfaces, electrical characteristics, and air-side components can be customized according to application requirements.
A Liquid-to-Air Thermoelectric Cooler Assemblies uses the Peltier effect to move heat from the liquid side to the air side.
The basic thermal path is:
●iquid → Cold Plate → TEC Module → Heat Sink → Fan → Ambient Air
When DC power is applied to the TEC module, heat is absorbed from the liquid cold plate and transferred to the hot-side heat sink. The fan then forces air through the heat sink to remove the heat into the surrounding environment.
The cooling performance depends on the TEC module, liquid flow rate, thermal interface, hot-side heat dissipation, ambient temperature, and electrical operating conditions.
Used for temperature stabilization of laser systems, optical components, and other liquid-cooled optoelectronic equipment.
liquid-to-Air Thermoelectric Cooler Assemblies are suitable for analytical instruments, laboratory temperature-control systems, and test equipment requiring stable liquid temperatures.
Can be integrated into medical and diagnostic equipment where compact liquid temperature control is required.
Suitable for cooling liquid loops in electronic equipment, control systems, sensors, and other heat-sensitive industrial devices.
Can be used for localized thermal management of battery-related components and other systems requiring liquid cooling.
Suitable for applications requiring controlled liquid temperatures without compressor-based refrigeration.
X-Meritan can develop Liquid-to-Air Thermoelectric Cooler Assemblies according to application-specific thermal and mechanical requirements.
Customization can include:
● TEC module size and configuration
● Cooling capacity
● Liquid cold plate dimensions
● Liquid inlet and outlet configuration
● Tubing or fitting requirements
● Liquid flow rate
● Heat sink dimensions
● Fan size and airflow
● Operating voltage and current
● Temperature sensors
● Mounting structure
● Electrical connections
● Overall assembly dimensions
Customers can provide thermal requirements, engineering drawings, existing samples, or equipment specifications for evaluation.
Integrated TEC Solutions: TEC modules, liquid cold plates, heat sinks, and fans can be designed as one thermal assembly.
Thermoelectric Material Expertise: In-house thermoelectric material development supports application-specific TEC configurations.
Custom Thermal Design: Cooling capacity, liquid flow, dimensions, and electrical parameters can be matched to the actual system.
Prototype to Production: Support from thermal design and prototype development to testing and volume production.
Application-Focused Engineering: The design considers the complete thermal path rather than selecting the TEC module separately.
It is an integrated cooling assembly that uses a thermoelectric module to transfer heat from a liquid circuit to the surrounding air. It consists of a liquid cold plate, a thermoelectric cooler (TEC) module, an air-cooled radiator, and a fan.
A liquid-cooled TEC assembly cools the liquid through a cold plate and dissipates the heat to the surrounding air through a radiator. This configuration is very useful when a heat source is connected to the liquid circuit, or when liquid cooling provides better thermal contact with the target equipment.
Yes. By reversing the polarity of the TEC module, the direction of heat transfer can be reversed, allowing the same assembly to provide either active heating or cooling when the system design supports bidirectional temperature control.
The most useful information includes heat load, liquid type, liquid flow rate, inlet temperature, target temperature, ambient temperature, available installation space, power supply, and connection requirements. Engineering drawings or samples can also help us evaluate the mechanical structure.
Yes. Liquid inlet/outlet connections, cold plate dimensions, radiator configuration, fan selection, mounting structure, and overall assembly dimensions can all be customized to suit the application.
Address
Building C2, R&F Center, Shangpu Road, Taijiang District, Fuzhou City, Fujian Province, China
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Ready to start your next thermal management project or request a competitive price quote? The X-meritan engineering and sales team is standing by to analyze your project requirements, recommend suitable standard TEC models, or discuss fully custom thermoelectric cooler manufacturing options.
Simply fill out the inquiry form with your operating parameters—such as heat load, ambient temperature, target cold-side temperature, dimensions, and estimated annual volume. Our technical sales engineers will review your thermal constraints and respond with a detailed quotation and engineering assessment within 24 business hours.
