X-Meritan encompasses capabilities in thermoelectric material development, thermoelectric cooler (TEC) component manufacturing, and thermal solution design. These Micro Thermoelectric Coolers for Optoelectronic devices utilize the Peltier effect for active cooling or heating, eliminating the need for compressors, refrigerants, or moving mechanical parts. They are suitable for temperature-sensitive components such as laser diodes, optical communication devices, photodetectors, lidar modules, and other compact optoelectronic components.
● Miniaturized design, suitable for space-constrained optoelectronic and precision electronic packaging.
● Supports precise temperature control, helping to reduce the impact of temperature drift on device performance.
● Solid-state cooling structure, no moving parts, ensuring stable and reliable long-term operation.
● High-temperature capability: Suitable for applications requiring stable temperature control under elevated ambient temperatures.
● No vibration or mechanical noise: The solid-state structure is suitable for precision optical systems and sensitive measurement equipment.
● RoHS compliant, facilitating application in global market projects.
● Temperature control for optical communication devices, especially peripheral temperature control for laser diodes, DFBs, EMLs, and TOSA/ROSA.
● Temperature stabilization of LiDAR transmitters and receivers.
● Light sources and sensing units in medical testing equipment.
● Precision optical test benches and laboratory calibration platforms.
● Packaging applications requiring small size, low vibration, and fast response.
When selecting Micro Thermoelectric Coolers for Optoelectronic, consider the following parameters:
Dimensions: Customized based on the device base and mounting chamber
Thickness: Must balance thermal resistance, clamping force, and assembly space
Maximum operating current: Must match the drive power supply and temperature control strategy
Maximum temperature difference (Delta Tmax): Depends on the heat sink conditions at the hot end
Heat Pump Capacity (Qmax): Determines how much heat can be removed
Resistance and Voltage: Affect drive losses and control accuracy
Heat source dimensions: Laser chip, TO package, microsensor, or integrated optoelectronic module.
Interface materials: Nickel plating, solder compatibility, or special metallization requirements.
Operating temperature range: Room-temperature stabilization, low-temperature operation, or high-temperature compensation.
Structural requirements: Ultra-thin construction, higher heat pump density, or other space restrictions.
|
Parameter |
Typical / Available Value |
|
Minimum Size |
1.5 × 1.1 mm |
|
Minimum Thickness |
0.65 mm |
|
Heat Pump Density |
Up to approx. 43 W/cm² |
|
Cooling / Heating |
Bidirectional |
|
Dimensions |
Customizable |
|
Electrical Parameters |
Application-specific |
|
Metallization |
Customizable |
|
Compliance |
RoHS |
Miniature TEC Design：Micro TECs as small as 1.5 × 1.1 mm, with a minimum thickness of 0.65 mm.
High Heat Pump Density：Up to approximately 43 W/cm², suitable for compact, high-heat-flux applications.
Thermoelectric Material Expertise：In-house thermoelectric material development supports optimized TEC performance and application-specific designs.
Custom TEC Solutions：Customized dimensions, electrical characteristics, material configuration, metallization, and connection structures based on application requirements.
From Prototype to Production：Support from thermal design and prototype development to testing and volume production.
Standard heat sinks only provide passive cooling, so the device temperature fluctuates with changes in ambient temperature. Micro thermoelectric coolers, on the other hand, actively control temperature, bringing the operating temperature back within the target range, making them ideal for optoelectronic systems that are sensitive to temperature drift.
The focus should not be solely on the cooling plate itself, but on the entire thermal path: heat source contact, interface materials, heat sink design, and whether the drive current is properly matched.
Yes. X-Meritan can evaluate custom sizes and configurations based on engineering drawings, samples, or application specifications. Customization includes dimensions, electrical characteristics, P/N material configuration, connection structure, and interface requirements.
Address
Building C2, R&F Center, Shangpu Road, Taijiang District, Fuzhou City, Fujian Province, China
Tel
Ready to start your next thermal management project or request a competitive price quote? The X-meritan engineering and sales team is standing by to analyze your project requirements, recommend suitable standard TEC models, or discuss fully custom thermoelectric cooler manufacturing options.
Simply fill out the inquiry form with your operating parameters—such as heat load, ambient temperature, target cold-side temperature, dimensions, and estimated annual volume. Our technical sales engineers will review your thermal constraints and respond with a detailed quotation and engineering assessment within 24 business hours.
