Products

The High-Precision NTC Thermistor Chip is designed for temperature sensing in compact electronic and optical modules where installation space is limited. X-Meritan provides chip structures with sizes available from 0.3 mm, resistance values from 1kΩ to 1000kΩ, and B values from 3200K to 4500K. Resistance tolerance options of ±0.5% and ±1% are available for selected requirements.

X-Meritan Film-Packaged NTC is a compact thin-film thermistor designed for fast and reliable temperature sensing. Featuring a 3950 K B value, ≤3-second typical response time, 1 J/K heat capacity, and -40°C to +125°C operating range, it offers excellent sensitivity and chemical resistance. Resistance options such as 10kΩ, 47kΩ, and 100kΩ can be evaluated according to application requirements, making it suitable for industrial, medical, automotive, battery, and consumer electronics.

Source X-meritan Peltier Assembly for integrated thermoelectric cooling with TEC chips, ceramic substrates, thermal interface materials, heat transfer blocks, heat sinks, and fans. Designed for fiber optics, medical equipment, automotive electronics, and research instruments requiring localized temperature control and efficient heat dissipation.

X-Meritan is an experienced China manufacturer specializing in Peltier Cooling Assembly solutions for optical communication modules, medical testing equipment and precision thermal control systems. Based on semiconductor technology, the assembly provides quiet operation without moving parts and supports accurate temperature management.

X‑Meritan supplies custom Customized Headers with Thermoelectric Coolers for active chip‑level thermal control in hermetic packaging. By soldering micro TECs directly onto TO‑can, BTF, or BOX headers via eutectic bonding, these assemblies reduce thermal resistance and avoid outgassing. Dimensions, pinouts, and TEC staging can be custom‑engineered for optical, sensing, and medical devices.

X-Meritan engineers and integrates Assemblies with Micro Thermoelectric Coolers directly into standard and custom optoelectronic packages, including TO-8, TO-39, 14-pin Butterfly (BTF), and BOX enclosures. By replacing secondary module attach with factory-level eutectic soldering (Rth minimized) inside hermetic housings, these micro-TEC sub-assemblies prevent optical facet contamination and drive sub-degree thermal stability. Designed for telecom TOSA/ROSA transceivers, IR/XRF detectors, and high-power laser diodes, each assembly is matched to specific package footprints, pin geometries, and thermal dissipation requirements.